When
TDK Semiconductor Corporation went out to bid for a 26,000 square foot,
three-story addition to their existing high-tech research and development
facility Bill Litchfield Construction (BLC) was the successful low bidder,
but the project did not meet TDK's budget requirements.
BLC
performed a constructability analysis which indicated that a substantial
savings in time and money could be achieved by changing the wood design
to steel. BLC was able to reduce the project cost by 5%, an approximate
$119,000 savings, which brought the project into budget. The facility
was completed and occupied six months from ground-breaking. This project
won the Western United States Most Outstanding Steel Construction Award
from CECO Buildings.
